New Ultrathin Wafer Bonding Boosts MEMS/NEMS Apps

Read original story

New Ultrathin Wafer Bonding Boosts MEMS/NEMS Apps
Description A key industry milestone has been reached today surrounding the handling and processing of ultrathin wafers. In their ongoing joint development work, EV Group (EVG), a leading supplier of wafer-bon...
Imported on 01 Jan 2008, 20:15
Feed Name A to Z Nanotech
Feed URL http://www.azonano.com/rss.asp
This RSS news item comes from another site. NanoScienceWorks and the Taylor and Francis Group are not responsible for the content of that site.
© NanoScienceWorks - Made possible by an endowment from Taylor & Francis Group
For the best viewing experience we recommend Firefox 2 or Internet Explorer 7